With a thermal conductivity of 128 W/m-K, its formula is designed for strictly professional use. It provides efficient dissipation and unrivaled durability, making it essential for applications requiring precision and thermal performance. Do not apply to heat sinks or aluminum surfaces.
Request a quoteMAIN APPLICATIONS
Its exclusive formulation is ideal for GPUs, CPUs and Video Games that require high performance in thermal management.
TRANSPORTATION AND STORAGE
It should be transported and stored in accordance with common practice with chemical products. Check the classification of this product before transporting it.
HANDLING AND APPLICATION METHOD
Clean the surface with Implastec cleaning solutions, apply a small amount of TS-FUSION directly onto the processor or component using the applicator needle. Then use the flexible rod to spread the product evenly over the two surfaces that will come into contact, ensuring full coverage and avoiding excess.
ATTENTION: the product MUST NOT be applied to aluminum heat sinks or any aluminum surface. Conductive material. NO contact with electrical or electronic circuits, risk of short circuit. STRICTLY PROFESSIONAL USE.
OBSERVATIONS
The information and data contained in this bulletin correspond to our current knowledge gathered by qualified and reliable technical personnel. It should be taken as a guide and not as a guaranteed specification. In any case of use, the customer should test performance by relying on information we can provide. Indications of use are not suggestions for patent or legal infringement. Since we have no control over use by third parties, our liability is limited to our product only.
VALIDITY
60 months from date of manufacture. Manufacturing date see packaging.
COMPOSITION
Gallium, indium and silver.