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+55 15 3500-2020
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TS PAD is an interface material with high conductive performance and was developed with the aim of eliminating air gaps and improving heat transfer efficiency. Its thermal performance makes it more cost-effective than other equivalent materials.
Request a quoteMAIN APPLICATIONS
Suitable for interfacing with high-power semiconductors such as video games, GPU memories and gaming computers.
MODELS:
- 0.5 mm - 1.0 mm- 1.5 mm- 2.0 mm- 2.5 mm- 3.0 mm (100mm X 100mm)
TRANSPORTATION AND STORAGE
The material should be transported carefully so as not to dent or damage the product. Store in a dry place, protected from dust.
HANDLING AND APPLICATION METHOD
Clean the entire surface with Implastec Isopropyl Alcohol, removing all residue. After cleaning, cut out the material and glue it to cover the entire area you want to improve heat dissipation and create contact with the heat sink.
REMARKS
The information and data contained in this bulletin correspond to our current knowledge gathered by qualified and reliable technical personnel. It should be taken as a guide and not as a guaranteed specification. In any case of use, the customer should test performance by relying on information we can provide. Indications of use are not suggestions for patent or legal infringement. Since we have no control over use by third parties, our liability is limited to our product only.
VALIDITY:
Indefinite.