Soldering Flux - No Clean

MAIN APPLICATIONS

Soldering Flux - No Clean is suitable for soldering copper-based or tin-plated parts, where there must be no corrosive residues and/or rosin resins. It eliminates the need to wash the part after soldering and the use of cleaning solvents that are harmful to the atmosphere's ozone layer.

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STORAGE

SHELF LIFE: 36 months, provided storage instructions are followed. MANUFACTURE DATE: see bottle.

STORAGE: Store in a well-ventilated area. Keep in a cool place.

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HANDLING AND APPLICATION METHOD

Apply the product to the areas to be soldered and solder the component.

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‍OBSERVATIONS

The information and data contained in this bulletin correspond to our current knowledge gathered by qualified and reliable technical personnel. It should be taken as a guide and not as a guaranteed specification. In any case of use, the customer should test performance by relying on information we can provide. Indications of use are not suggestions for patent or legal infringement. Since we have no control over use by third parties, our liability is limited to our product only.

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QUANTITY PER BOX

- 110 mL - 60 units per box.

- 250 mL - 18 units per box.

- 500 mL - 10 units per box.

- 1000 mL - 10 units per box.

- 5000 mL - 2 units per box.

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