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IPT 300 - Thermal Paste

Thermal Paste is obtained by the convenient addition of silicone polymers and metal oxides. It is used as a heat conductor in electro-electronic assemblies due to its high dielectric strength and excellent thermal conduction. It is highly resistant to arcing and has no dropping point. It is especially suitable for assemblies where perfect coupling between the semiconductor and the heat sink is required. It improves conduction by eliminating air trapped in the assembly.

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Thermal Paste is chemically inert, non-corrosive or toxic and has excellent stability. It can operate at temperatures of up to 250ºC without losing its main properties. For a short period it can withstand temperatures of 300ºC.

MAIN APPLICATIONS

Widely used in the assembly of semiconductors and other components, where there is a need for efficient elimination of the heat generated.

In addition to semiconductor assembly, Thermal Paste has been successfully used to improve the response time of thermocouples and thermoresistors in temperature measurement systems, as a conductive paste in refrigeration system heat exchangers. Thermal coupling of plastic injection molding gun resistors.

TRANSPORTATION AND STORAGE

It should be transported and stored in accordance with common practice with chemical products. Check the classification of this product before transporting it.

HANDLING AND APPLICATION METHOD

With a spatula, brush or pump. Wear safety glasses.

REMARKS

The information and data contained in this bulletin correspond to our current knowledge gathered by qualified and reliable technical personnel. It should be taken as a guide and not as a guaranteed specification. In any case of use, the customer should test performance by relying on information we can provide. Indications of use are not suggestions for patent or legal infringement. Since we have no control over use by third parties, our liability is limited to our product only.

Stretching
Appearance
Aspect
Base
Silicone
Compatibility
Conductivity
0.4 W/mK
Consistency NLGI Grade
2 | 3
Color
White
Density
Hardness
Packaging
10g | 15g | 40g | 50g | 100g | 450g | 500g | 1000g
Thickness
Average thickness
Stability
NLGI grade
2 | 3
Material
Penetration (mm/10)
Freezing point
Drop point
No drop point
Flash point
Active ingredient
Propellant
Thermal resistance per cm²
Rupture
Solubility in water
0.04 g/100mL
Solvents
Temperature