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TS-PUTTY is a product with the right viscosity and stability to be used as a thermal interface material. It can be molded and accommodated in various electronic components, and is especially suitable for use as a replacement for thermal pads.
Request a quoteIts silicone-based formulation and materials with high thermal conductivity guarantee good accommodation and stability even in the most demanding applications.
MAIN APPLICATIONS
Suitable for interfacing with high-power semiconductors such as video games, GPU memories and gaming computers.
TRANSPORTATION AND STORAGE
It should be transported and stored in accordance with common practice with chemical products. Store in a dry place, protected from dust.
HANDLING AND APPLICATION METHOD
Clean the entire surface with Implastec Isopropyl Alcohol, removing all residue. After cleaning, apply the product to the surface and spread it out so that it covers the entire surface and is thick enough to come into contact with the heat sink.
REMARKS:
The information and data contained in this bulletin correspond to our current knowledge gathered by qualified and reliable technical personnel. It should be taken as a guide and not as a guaranteed specification. In any case of use, the customer should test performance by relying on information we can provide. Indications of use are not suggestions for patent or legal infringement. Since we have no control over use by third parties, our liability is limited to our product only.