TS-PRÓ Thermal Paste was developed to meet the growing need for cooling in electronic components due to its high thermal conductivity, viscosity suitable for the application, durability and stability.
Request a quoteThese characteristics are possible due to its modern formula, which combines a mixture of materials with high thermal conductivity with a special silicone fluid, thus guaranteeing exceptional performance in a wide variety of applications.
MAIN APPLICATIONS
TS-PRÓ Thermal Paste has been specially developed for use in CPUs, video cards, video games and any other application that requires high thermal dissipation.
TRANSPORTATION AND STORAGE
It should be transported and stored in accordance with common practice with chemical products. Check the classification of this product before transporting it.
HANDLING AND APPLICATION METHOD
Clean the surface with Implastec Isopropyl Alcohol or a TS-CLEANER wipe. Apply TS-PRÓ to the processor or component, using a spatula to spread the product over the entire area in a thin layer.
REMARKS
The information and data contained in this bulletin correspond to our current knowledge gathered by qualified and reliable technical personnel. It should be taken as a guide and not as a guaranteed specification. In any case of use, the customer should test performance by relying on information we can provide. Indications of use are not suggestions for patent or legal infringement. Since we have no control over use by third parties, our liability is limited to our product only.
VALIDITY
36 months from date of manufacture. Manufacturing date see packaging.
COMPOSITION
Metal oxides and synthetic oils.