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+55 (15) 3500-2020
+55 15 3500-2020
vendas@implastec.com.br
Oswaldo Pires de Camargo Est., 70
Votorantim - SP
Interface material with high conductive performance, developed to eliminate air gaps and improve heat transfer efficiency. It has a better cost-benefit ratio than other equivalent materials, with a 70% lower thermal impedance compared to the mica/thermal paste combination.
Request a quoteMAINAPPLICATIONS
The main application of the Thermal Pad is in electronic components where there is a need to generate contact between the component and the heat sink.
PACKAGING
- TO 220 (19.3 x 13.5 mm) - with or without hole
- TO 92 (28 x 22 mm) - with or without hole
- TO 3 (oval)
- TO 218 (22 x 16 mm) - with or without hole
- 20mm and 75mm strips
*Custom formatson request
TRANSPORTAND STORAGE
The material should be stored in a dry place and protected from dust.
REMARKS
The information and data contained in this bulletin correspond to our current knowledge gathered by qualified and reliable technical personnel. It should be taken as a guide and not as a guaranteed specification. In any case of use, the customer should test performance by relying on information we can provide. Indications of use are not suggestions for patent or legal infringement. Since we have no control over use by third parties, our liability is limited to our product only.