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Thermal Pad - Thermally conductive adhesive

Interface material with high conductive performance, developed to eliminate air gaps and improve heat transfer efficiency. It has a better cost-benefit ratio than other equivalent materials, with a 70% lower thermal impedance compared to the mica/thermal paste combination.

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‍MAINAPPLICATIONS

The main application of the Thermal Pad is in electronic components where there is a need to generate contact between the component and the heat sink.

PACKAGING

- TO 220 (19.3 x 13.5 mm) - with or without hole

- TO 92 (28 x 22 mm) - with or without hole

- TO 3 (oval)

- TO 218 (22 x 16 mm) - with or without hole

- 20mm, 30mm, 35mm and 70mm tapes

*Custom formatson request

‍TRANSPORTAND STORAGE

The material should be stored in a dry place and protected from dust.

REMARKS

The information and data contained in this bulletin correspond to our current knowledge gathered by qualified and reliable technical personnel. It should be taken as a guide and not as a guaranteed specification. In any case of use, the customer should test performance by relying on information we can provide. Indications of use are not suggestions for patent or legal infringement. Since we have no control over use by third parties, our liability is limited to our product only.

Stretching
5 %
Appearance
Aspect
Base
Compatibility
Conductivity
1.2 W/mK
Consistency NLGI Grade
Color
Green
Density
Hardness
Packaging
Roll | Pack of 1000
Thickness
0.23 ± 0.03 mm
Average thickness
Stability
NLGI grade
Material
Silicone / Fiberglass - adhered
Penetration (mm/10)
Freezing point
Drop point
Flash point
Active ingredient
Propellant
Thermal resistance per cm²
0.31 °C / WDielectric Strength: 2,500 Volts
Rupture
≥ 3.0 KV/mm
Solubility in water
Solvents
Temperature
-40 - 400 °C