TS-COLD - Thermal Paste

Its high ability to conduct heat, due to the heat-conducting agents in its formula, makes TS-COLD the ideal paste for use in the assembly and maintenance of various high-end electronics. The choice of a special silicone fluid gives the paste the perfect viscosity for quick and easy application, and guarantees a long service life due to its excellent thermal stability.

MAIN APPLICATIONS

TS-COLD thermal paste has been developed to be applied to CPUs with high processing capacity, modern video cards, video games of all generations, computers that use advanced software, servers and any other application where an excellent quality thermal paste is required.

TRANSPORTATION AND STORAGE

It should be transported and stored in accordance with common practice with chemical products. Check the classification of this product before transporting it.

HANDLING AND APPLICATION METHOD

Clean the surface with Implastec Isopropyl Alcohol, or TS-CLEANER wet wipe. Apply TS-COLD to the processor or component. With a spatula, spread the product over the entire area in a thin layer.

REMARKS

The information and data contained in this bulletin correspond to our current knowledge gathered by qualified and reliable technical personnel. It should be taken as a guide and not as a guaranteed specification. In any case of use, the customer should test performance by relying on information we can provide. Indications of use are not suggestions for patent or legal infringement. Since we have no control over use by third parties, our liability is limited to our product only.

VALIDITY

36 months from date of manufacture. Manufacturing date see packaging.

COMPOSITION

Metal oxides and synthetic oils.