Soldering Paste - Soldatec

It acts as a soldering flux, activating the metal-metal bond by deoxidizing the parts to be joined. The residue from this deoxidization and soldering process is completely soluble in ethyl or isopropyl alcohol, the latter being widely used in the electronics industry.

MAIN APPLICATIONS

Soldering using the tin process.

TRANSPORTATION AND STORAGE

It should be transported and stored in accordance with common practice with chemical products.Check the classification of this product before transporting it.

Product shelf life: 36 months.

HANDLING AND APPLICATION METHOD

It can be applied directly to the area to be soldered or directly to the tin bar and/or tin wire. Wear goggles and avoid direct inhalation of vapors.

REMARKS

The information and data contained in this bulletin correspond to our current knowledge gathered by trained and reliable technical personnel. It should be taken as a guide and not as a guaranteed specification. In any case of use, the customer should test performance by relying on information we can provide. Indications of use are not suggestions for patent or legal infringement. Since we have no control over use by third parties, our liability is limited to our product only.

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