Designed to offer superior performance in every detail, even in the most delicate processes. With its ideal viscosity, it guarantees precise and uniform application, as well as a high level of activation that results in clean, safe welding without the need for rework.
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It has been specially developed for soldering electronic microcomponents using SMD (Surface Mount Device) technology and for reballing chipsets. It guarantees optimum soldering quality, generating little smoke during the process, with an adequate viscosity, allowing the tin balls to be directed to their islands and with a durability suitable for the most complex procedures.
TRANSPORTAND STORAGE
It should be transported and stored in accordance with common practice with chemical products. Check the classification of this product before transporting it.
HANDLINGAND METHOD OF APPLICATION
Can be applied directly to the area to be soldered or directly to the bar and/or tin wire. Wear safety goggles and avoid direct inhalation of vapors.
VALIDITY
24 months from date of manufacture. Manufacturing date see packaging.
COMPOSITION
Rosin, solvents, organic acid and thickener.
REMARKS
The information and data contained in this bulletin correspond to our current knowledge gathered by qualified and reliable technical personnel. It should be taken as a guide and not as a guaranteed specification. In any case of use, the customer should test performance by relying on information we can provide. Indications of use are not suggestions for patent or legal infringement. Since we have no control over use by third parties, our liability is limited to our product alone.