Soldering Flux - No Clean

MAIN APPLICATIONS

Soldering Flux - No Clean is suitable for soldering copper-based or tin-plated parts, where there must be no corrosive residues and/or rosin resins. It eliminates the need to wash the part after soldering and the use of cleaning solvents that are harmful to the atmosphere's ozone layer.

TRANSPORTATION AND STORAGE

Store in the original packaging, in a covered, dry and ventilated place, away from sources of heat or ignition, maximum temperature 50ºC. Keep away from children, animals and unfit persons.

Product shelf life: 36 months.

HANDLING AND APPLICATION METHOD

Wear a mask and goggles to protect against inhalation vapors and splashes. Use in a well-ventilated area.

REMARKS

The information and data contained in this bulletin correspond to our current knowledge gathered by qualified and reliable technical personnel. It should be taken as a guide and not as a guaranteed specification. In any case of use, the customer should test performance by relying on information we can provide. Indications of use are not suggestions for patent or legal infringement. Since we have no control over use by third parties, our liability is limited to our product only.

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